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TP-2160 Gap Filler Thermal Pad

Resin Designs

$0.00
SKU:
TP-2160 Gap Filler Thermal Pad
spec_Specific_Gravity:
1.8
Specific_Gravity:
1.8
Short_Description:
This highly compressible silicone gap filler offers moderate bulk conductivity and a highly conductive non-tacky surface on one side. Foam reinforcement ensures easy handling, simplifies application, and enhances long-term reliability.
On_Web_(Y/N):
Yes
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A highly compressible, silicone gap filler with moderate bulk conductivity delivered with a highly conductive non-tacky surface on one side. This filler uses foam reinforcement to maintain compressibility while providing easy handling to simplify application and improve long-term reliability.  It is ideal for use in low-power applications requiring heat transfer across any large air gap

Overview

A highly compressible, silicone gap filler with moderate bulk conductivity delivered with a highly conductive non-tacky surface on one side. This filler uses foam reinforcement to maintain compressibility while providing easy handling to simplify application and improve long-term reliability.  It is ideal for use in low-power applications requiring heat transfer across any large air gap

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